LT CIRCUIT CO.,LTD

Printed Circuit Board Manufacturer, focus on Multilayer PCB and Metal Core PCB.

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Printed Circuit Board Assembly Capabilities

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Printed Circuit Board Assembly Capabilities

LT CIRCUIT CO.,LTD. Capabilities Introduction

 We have customers from various fields including, Communication Equipment, Industrial and Medical, Computer, and Defense Science. LT establishes good cooperation with thousands of clients around the world. 

 

Capability for Rigid PCB

 

 

High precision prototype

PCB bulk production

Max Layers

1-28 layers

1-14 layers

MIN Line width(mil)

3mil

4mil

MIN Line space(mil)

3mil

4mil

Min via (mechanical drilling)

Board thickness≤1.2mm

0.15mm

0.2mm

Board thickness≤2.5mm

0.2mm

0.3mm

Board thickness>2.5mm

Aspect Ration≤13:1

Aspect Ration≤13:1

Aspect Ration

Aspect Ration≤13:1

Aspect Ration≤13:1

Board thickness

MAX

8mm

7mm

MIN

2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm

2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm

MAX Board size

610*1200mm

610*1200mm

Max copper thickness

0.5-6oz

0.5-6oz

Immersion Gold/

Gold Plated Thickness

Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u”

 

Hole copper thick

25um 1mil

25um 1mil

Tolerance

Board thickness

Board thickness≤1.0mm:+/-0.1mm
1.0mm≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%

Board thickness≤1.0mm:+/-0.1mm
1.0mm≤2.0mm:+/-10%
 Board thickness>2.0mm:+/-8%

Outline Tolerance
 

≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
 >300mm:+/-0.2mm

≤100mm:+/-0.13mm
100<  ≤300mm:+/-0.15mm
 >300mm:+/-0.2mm

Impedance

±10%

±10%

MIN Solder mask bridge

 0.08mm

 0.10mm

Plugging Vias capability

 0.25mm--0.60mm

 0.70mm--1.00mm

 

 

Capability for Metal Core PCB

 

Base material: Aluminum/Copper/Iron Alloy

Thermal Conductivity (dialectical layer): 0.8, 1.5, 2.0, 3.0 W/m.K.

Withstand voltage: 2000-6000V

Board Thickness: 0.5mm~3.0mm (0.02"~0.12")

Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ

Outline: Routing, punching, V-Cut

Solder mask: White/Black/Blue/Green/Red Oil, Taiyo PSR4000

Legend/Silkscreen Color: Black/White

Surface finishing: Immersion Gold, HASL, OSP

Max Panel size: 600*1200mm (23.62"*47.24")

Packing: Vacuum/Plastic bag

Samples L/T: 4~6 Days

 

 

Capability for Flexible PCB

 

Item  Description  Common  Special
1 NO. OF Layer  1--6  
2 FINISHED BOARD SIZE(MAX)  250*500mm  OK
3 FINISHED BOARD SIZE(MIN)  10*15mm  OK
4 BOARD THICKNESS(MAX)  0.016"(0.4mm)  OK
5  BOARD THICKNESS(MIN)  0.00328"(0.085)  OK
6 FINISHED BOARD THICKNESS FOLERANCE 0.085mm≦Board Thickness<0.4mm ±2mil(±0.05mm)  OK
7  DRILL HOLE DIAMETER(MAX)  0.236"(6.0mm)  OK
8 DRILL HOLE DIAMETER(MIN)  0.010"(0.25mm)  OK
9 For Machine Drill                 FINISHED VIA DIAMETER(MIN)  0.008"(0.2mm) OK
10 OUTER LAYER BASE COPPER  THICKNESS(MIN)  1/2OZ(0.01778mm)  OK
11  OUTER LAYER BASE COPPER     THICKNESS(MAX)  1OZ(0.0355mm)  OK
12 INNER LAYER DIELECTRIC  THICKNESS(MIN)  0,0127mm(1/2mil)  OK
13 INNER LAYER DIELECTRIC THICKNESS(MAX)  0.0254mm(1mil)  OK
14 BASE.MATERIAL  PI(260℃ TG)  OK
15 HOLE DIAMETER TOLERANCE(PTH)  ±2mil(±0.05mm)  ±1.5mil
16 HOLE DIAMETER TOLERANCE(NPTH)  ±1mil(±0.025mm)  ±1.5mil
17 HOLE POSITION TOLERANCE           (COMPARED WITH CAD DATA) ±3mil(±0.076mm)  OK
18 PTH HOLE COPPER THICKNESS  ≧0.5mil(≧0.0125mm)  OK
19  LAVER DESIGN LINE WIDTH/SPACING(MIN) 4mil/4mil(0.1016mm/0.1016mm)Multilayer 2.5mil/2.5mil(0.0635mm/0.06 35mm)Double side,single layer 0.5OZ OK
20 TOLERANCE AFTER ETCHING  ≦±20%(common)  ±10% for impedance
21 IMAGE TO IMAGE TOLERANCE(MIN)  ±5mil(±0.127mm)        ±4mil ±3mil(0.076mm)
22 IMAGE TO EDGE TOLERANCE(MIN)  ±4mil(±0.1mm)  OK
23 LEGEND MASK REGISTARTION(MIN)  ±6mil(±0.15mm) OK
24 SOLDERMASK REGISTARTION(MIN)  ±6mil(±0.15mm) OK
25 SOLDERMASK THICKNESS(MIN)  10UM  OK
26 CVL REFISTRATION(MIN)  8mil(4mil)  OK
27  CVLL Pressure and glue quantity  (MIN)  5.6mil(2.4mil)  OK
28 SOLDER TIN LEAD THICKNESS ON FINGER OR PAD.(MAX)           (MIN)AND TOLEARANCE THICKNESS (1.0mil)(0.1mil)        ±0.30mil  ±0.15mil
29 GOLD FINGER NICKEL THICKNESS(MAX) 200u"±100u"  OK
30 SOLDER THICKNESS ON PADS(HAL)(MIN)  0.1mil  OK
31 NICKEL THICKNESS FOR   ELECTROLESS NICKEL AND  INMERSION GOLD(MEASLRED AT THE MINTMUM POINT)(MAX) 200u"±50u"/1-4u" OK
32  SOLDER THICKNESS ON PADS (HAL)(MAX)  1.2mil  OK
33 SOLDERTHICKNESS ON PADS (HAL)(MIN)  0.1mil OK
34  PUNCHING HOLE (MIN-MAX)DIAMETER TOLERANCE  0.5-6.0mm±0.05mm  OK
35 THE TOLERANCE OF PASTEING ADHESIVE AND STIFFER  ±0.20mm  ±0.10mil
36 PUNCHING DIE DIMENSION TOLERANCE (EDGE TO EDGE)(STEELDIE)Steel Die ±4mil(±0.1mm)  ±2mil
37 PUNCHING DIE DIMENSION TOLERANCE (HOLE TO EDGE)(STEELDIE)Steel Die ±4mil(±0.1mm)  ±2mil
38 PUNCHING DIE DIMENSION TOLERANCE (HOLE TO EDGE)(STEELDIE)cutting die ±8mil(±0.2mm)  ±6mil
Contact Details
LT CIRCUIT CO.,LTD

Contact Person: Ms. Ashley

Tel: 86-755-23005997

Fax: 86-755-23305997

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